Q7-BT

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Qseven Module with 4th Generation Intel Atom® Processor E3800 Series SoC (formerly codename: BayTrail)

Single, dual, or quad-core 4th Generation Intel® Atom™ Processor E3800 Series System-on-Chip
Up to 4 GB DDR3L at 1066/1333 MHz
HDMI 1.4b and dual-channel LVDS
GbE, MIPI CSI camera interface
2x SATA 3Gb/s or 1x SATA and 1x SATA-SSD
Extreme Rugged™ -40°C to +85°C or commercial temp. 0°C to +60°C
Supports Smart Embedded Management Agent (SEMA) functions 2.5 or 3.0.

Categories: Computer-on-Modules, Qseven, Qseven Modules

Description

The Qseven form factor affords a more compact profile and footprint than the other COM platforms.

With mechanical dimensions as small as 70mm in width, 70mm in length, and 2.3mm in overall height, Qseven ranks as the smallest COM standard currently available.

The Q7-BT module utilizes the E3800 SoC for contemporary, high-bandwidth interfaces such as PCI Express, USB, Gigabit Ethernet, SATA, and HD Audio. The module generates its own LVDS, TMDS, and DisplayPort video signals using DDI output from the SoC. A series of optional eMMC devices offer up to 64GB of on-board NAND Flash storage with an MMC interface, and an optional SATA, Solid State Drive (SSD) provides up to 64GB of on-board NAND Flash storage. Two SPI Flash chips implement a fail-safe BIOS, allowing the user to boot the module even if current BIOS settings have corrupted the system.

Under the management of the BMC chip (Board Management Controller), the SEMA utility (Smart Embedded Management Agent) provides system control, security, and failure protection—counting, monitoring, and measuring hardware and software events, and using the SMBus to send corrective commands to the SoC. The optional SEMA Cloud utility not only controls local events on the module but system client events on the IoT.

SEMA

The Q7-BT Computer-On-Module (COM) combines the Qseven® 2.0 standard with the Intel® Atom™ E3800 series System-on-Chip (SoC), providing an ideal solution for mid-range power and high, pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The Qseven form factor affords a more compact profile and footprint than the other COM platforms. With mechanical dimensions as small as 70mm in width, 70mm in length, and 2.3mm in overall height, Qseven ranks as the smallest COM standard currently available. The Q7-BT module utilizes the E3800 SoC for contemporary, high-bandwidth interfaces such as PCI Express, USB, Gigabit Ethernet, SATA, and HD Audio. The module generates its own LVDS, TMDS, and DisplayPort video signals using DDI output from the SoC. A series of optional eMMC devices offer up to 64GB of on-board NAND Flash storage with an MMC interface, and an optional SATA, Solid State Drive (SSD) provides up to 64GB of on-board NAND Flash storage. Two SPI Flash chips implement a fail-safe BIOS, allowing the user to boot the module even if current BIOS settings have corrupted the system. Under the management of the BMC chip (Board Management Controller), the SEMA utility (Smart Embedded Management Agent) provides system control, security, and failure protection— counting, monitoring, and measuring hardware and software events.

Ordering Information

Q7-BT1-2G-8G-ER -:
Qseven module with Intel® Atom E3815, single core, 2 GB DDR3L, 8GB eMMC, -40°C to +85°C
Q7-BT4-4G-8GS-ER -:
Qseven module with Intel® Atom E3845, quad core, 4 GB DDR3L, 8GB SATA SSD, -40°C to +85°C
Q7-BT2-4G-8G-ER -:
Qseven module with Intel® Atom E3826, dual core, 4 GB DDR3L, 8GB eMMC, -40°C to +85°C
Q7-BT4-4G-8G-ER -:
Qseven module with Intel® Atom E3845, quad core, 4 GB DDR3L, 8GB eMMC, -40°C to +85°C
Accessory –
Q7-BT-HS -: Heatspreader for Q7-BT
Q7-BT-HS2 -: Passive heatsink for Q7-BT, dual core, 0°C to 70°C