DLAP-3200-CF Series

DLAP-3200-CF Series

Embedded System supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket

Key Features
  • Tech Square MXM Graphics module support (Type A/B, up to 120W)
  • 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor
  • Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)
  • DisplayPort (2 from CPU, 4 from MXM)
  • 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module
  • Reliable Molex type 12V DC-in connector
  • 1x Intel® i219-LM and 3x Intel® i210-AT
  • 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additional Molex 4 pin power cable (12V/1.5A and 5V/2A) support

    DATA SHEET

Use Case

Ordering Information

  • DLAP-3200-CFP1 -:
    Supporting EGX-MXM-P1000, Chipset Q370, DC-in 12V
  • DLAP-3200-CFP2 -:
    Supporting EGX-MXM-P2000, Chipset Q370, DC-in 12V
  • DLAP-3200-CFP12 -:
    Supporting EGX-MXM-P1000/P2000/ T1000/RTX3000/RTX5000 (not incl.), Chipset Q370, DC-in 12V
  • DLAP-3200-CFT1 -:
    Supporting EGX-MXM-T1000, Chipset Q370, DC-in 12V
  • DLAP-3200-CFT3 -:
    Supporting EGX-MXM-RTX3000, Chipset Q370, DC-in 12V
  • DLAP-3200-CFT5 -:
    Supporting EGX-MXM-RTX5000, Chipset Q370, DC-in 12V
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