COM-HPC-sIDH

COM-HPC-sIDH

COM-HPC Server Type Size D Module with Intel® Xeon® D-2700 Processor (formerly codename: Ice Lake-D)

Key Features
  • Up to 20 cores, 30MB cache
  • Edge AI (Intel® AVX-512 & VNNI)
  • 8x 10G Ethernet
  • 32 PCIe Gen4, 16 PCIe Gen3 lanes

    DATA SHEET

ADLINK’s COM-HPC-sIDH COM-HPC Server Type Size D module is based on the Intel® Xeon® D-2700 processor and features integrated high-speed Ethernet for up to 8x 10G or 4x 25G combined with 32 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), and AVX-512 technologies for optimal, accelerated AI performance, and support for Time-Sensitive Networking (TSN), it offers precise control for hard-real-time workloads across all networked devices.

Built for edge and rugged AI applications, this new ADLINK COM with Intel® Ice Lake-D empowers system integrators to realize all of their IoT innovations, from unmanned aerial vehicles, autonomous driving, and robotic surgery, to rugged HPC servers, 5G base stations, automatic drilling, ship management, and more.

Specifications:

  • Intel® Xeon® D-2700 processor
  • Up to 20 cores, 30MB cache
  • 8x 10G or 4x 25G Ethernet
  • 32 PCIe Gen4, 16 PCIe Gen3 lanes
  • Intel® AVX-512 VNNI, Intel® DL Boost
  • Up to 512GB DDR4 support
  • Dedicated PCIe and IPMB for remote management
  • 12V voltage input

Ordering Information

Ordering Information

  • COM-HPC-sIDH-D-2796TE -:
    Server Type COM-HPC Size D module with Intel® Xeon® D-2796TE
  • COM-HPC-sIDH-D-2775TE -:
    Server Type COM-HPC Size D module with Intel® Xeon® D-2775TE
  • COM-HPC-sIDH-D-2752TER -:
    Server Type COM-HPC Size D module with Intel® Xeon® D-2752TER
    Accessory
  • THSF-sIDHTL-B -: High profile heatsink with Fan for COM-HPC-sIDH with threaded standoffs for bottom mounting
    Starter Kit
  • COM-HPC Server Type Starter Kit -: Starter kit for COM-HPC Server Type

 

 

 

 

 

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