Express-SL/SLE

Express-SL/SLE

COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Xeon®, and Celeron® Processors (formerly codename: Skylake)

Key Features
  • 6th Gen Intel® Core™, Xeon®, and Celeron® Processor with Intel QM170/HM170/CM236 Chipset (codename: Skylake)
  • Up to 32GB dual channel ECC or non-ECC DDR4 at 2133 MHz
  • 3x DDI channels, 1x LVDS (or 4 lanes eDP), supports up to 3 independent displays
  • 8 PCIe x1 and 1 PCIe x16
  • GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged operating temperature: -40°C to +85°C (build option for Core & Celeron 25W TDP SKUs)

    DATA SHEET

The Express-SL/SLE is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 6th Generation Intel® Core™ and Xeon® E3-and Celeron® processors (codename “Skylake-H”) with IntelR QM170, HM170, CM236 Chipset.

The Express-SL/SLE is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution. The Express-SL/SLE features Intel® Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR4 dual-channel memory at 1866/2133 MHz with ECC/non-ECC support determined by CPU/chipset combination to provide excellent overall performance.

Intel® Flexible Display Interface and Direct Media Interface provide high-speed connectivity from the CPU to the Intel® QM170, HM170, CM236 Chipset. Integrated Intel® Generation 9 Graphics includes features such as OpenGL 4.4/4.3/4.2, DirectX 11, IntelR Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full H.265/HEVC, MPEG2 hardware codec. Graphics outputs include LVDS and three DDI ports supporting HDMI/DVI/DisplayPort and eDP as a build option.

The Express-SL/SLE is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time. The Express-SL/SLE has dual stacked SODIMM sockets supporting up to 32 GB of DDR4 ECC/non-ECC memory. In addition to the onboard integrated graphics, a multiplexed PCIe x16 graphics bus is available for discrete graphics expansion. Input/output features include a single onboard Gigabit Ethernet port, eight PCIe x1 Gen3 lanes, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as a remote console, hardware monitor, and watchdog timer.

SEMA

At the heart of SEMA is the Board Management Controller (BMC) supporting SEMA functions. The SEMA Extended EAPI provides access to all functions and can be integrated into the user’s own applications. The SEMA GUI and SEMA Command Line Interface allow monitoring, control, and use of the SEMA parameters and functions directly on your device for test and demonstration purposes. Optionally SEMA supports also remote procedure calls – please refer to SEMA Software Installation Guide.

Detailed forensic information is available after system or module failures. The BMC Power-Up Error Log function provides detailed information about history of failures that may have occurred during power-up sequences. Log information includes e.g. error number, flags, restart event, power cycles, boot count, status, CPU temperature, and board temperature. Moreover minimum and maximum temperature of the CPU and system is available, as well as HDD S.M.A.R.T information- all of which can be used to analyze system or module failure in detail.

SEMA is available for Linux and Windows operating systems and for various HW platforms

Ordering Information

  • Express-SL-G3900E -:
    Basic COM Express Type 6 module with Intel Celeron, G3900E and GT1 level graphics, HM170 chipset
  • Express-SLE-E3-1505L v5 -:
    Basic COM Express Type 6 module with Intel Xeon, E3-1505L v5 and GT2 level graphics, CM236 chipset, support ECC
  • Express-SLE-E3-1505M v5 -:
    Basic COM Express Type 6 module with Intel Xeon, E3-1505M v5 and GT2 level graphics, CM236 chipset, support ECC
  • Express-SLE-E3-1515M v5 -:
    Basic COM Express Type 6 module with Intel Xeon, E3-1515M v5 and GT4e level graphics, CM236 chipset, support ECC
  • Express-SL-i7-6822EQ -:
    Basic COM Express Type 6 module with Intel Core, i7-6822EQ and GT2 level graphics, QM170 chipset
  • Express-SL-i7-6820EQ -:
    Basic COM Express Type 6 module with Intel Core, i7-6820EQ and GT2 level graphics, QM170 chipset
  • Express-SL-i5-6442EQ -:
    Basic COM Express Type 6 module with Intel Core, i5-6442EQ and GT2 level graphics, QM170 chipset
  • Express-SL-i5-6440EQ -:
    Basic COM Express Type 6 module with Intel Core, i5-6440EQ and GT2 level graphics, QM170 chipset
  • Express-SL-i3-6100E -:
    Basic COM Express Type 6 module with Intel Core, i3-6100E and GT2 level graphics, HM170 chipset
  • Express-SL-i3-6102E -:
    Basic COM Express Type 6 module with Intel Core, i3-6102E and GT2 level graphics, HM170 chipset
    Accessory –
  • HTS-SL-B -: Heatspreader for Express-SL with threaded standoffs for bottom mounting
  • HTS-SL-BT -: Heatspreader for Express-SL with through hole standoffs for top mounting
  • THS-SL-BL -: Low profile heatsink for Express-SL with threaded standoffs for bottom mounting
  • THS-SL-BT -: Low profile heatsink for Express-SL with through hole standoffs for top mounting
  • THSH-SL-BL -: High profile heatsink for Express-SL with threaded standoffs for bottom mounting
  • THSF-SL-BL -: High profile heatsink with Fan for Express-SL with threaded standoffs for bottom mounting
  • THSF-SLE-GT4e-BL -: High profile heatsink with fan for Express-SL-E3-1515M v5 with threaded standoffs for bottom mounting
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