SMARC® Short Size Module with Intel Atom® E3900 Series, Pentium™ N4200, or Celeron™ N3350 Processor (codename: Apollo Lake)

Key Features
  • Dual or quad-core Intel Atom® E3900 Series or Pentium™ N4200 or Celeron™ N3350 Processor SoC
  • Up to 8 GB DDR3L at 1867 MHz
  • Triple display support
  • HEVC H.265, Dual-channel LVDS, HDMI/DP++, DP++, and 2x MIPI CSI camera (2/4 lanes)
  • 1x GbE with IEEE1588 (PTP) supported
  • 1x SATA 3.0, onboard eMMC
  • 4x PCIe x1
  • Windows 10 IoT Enterprise/Core and Yocto Linux supported


The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high-performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel’s industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.

The module primarily targets embedded intelligent systems used in several vertical market segments such as healthcare, industrial controllers and real-time systems, retail systems, edge IOT gateways, in-vehicle infotainment systems, printers, thin clients, industrial and ruggedized tablets, and many others. The LEC-AL supports contemporary, high-bandwidth interfaces such as Ultra HD HDMI, dual-channel LVDS, PCI Express Gen2, Gigabit Ethernet, USB 2.0/3.0, SATA Gen3, enhanced MIPI CSI camera, and a state-of-the-art HD Audio interface.

The module generates its own LVDS (18/24bit), TMDS, and Display Port ++ video signals using eDP and DDI output from the SoC. Two SPI Flash chips implement a fail-safe BIOS, allowing the user to boot the module even if current BIOS settings have corrupted the system. Under the management of the BMC chip (Board Management Controller), the SEMA utility (Smart Embedded Management Agent) provides system control, security, and failure protection— counting, monitoring, and measuring hardware and software events, and using the SMBus to send corrective commands to the SoC.

Ordering Information

  • LEC-AL-E3930-2G-16G-ER -:
    SMARC Short Size Module with Intel Atom® E3930, dual core, 2 GB DDR3L, 16GB eMMC, -40°C to 85°C
  • LEC-AL-E3940-4G-32G-ER -:
    SMARC Short Size Module with Intel Atom® E3940, quad core, 4GB DDR3L, 32GB eMMC, -40°C to 85°C
  • LEC-AL-E3950-8G-32G-ER -:
    SMARC Short Size Module with Intel Atom® E3950, quad core, 8GB DDR3L, 32GB eMMC, -40°C to 85°C
  • LEC-AL-N3350-4G-16G-CT -:
    SMARC Short Size Module with Intel® Celeron™ N3350, dual core, 4GB DDR3L, 16GB eMMC, 0°C to 60°C
  • LEC-AL-N4200-8G-32G-CT -:
    SMARC Short Size Module with Intel® Pentium™ N4200, quad core, 8GB DDR3L, 32GB eMMC, 0°C to 60°C

    Accessory –

  • LEC-AL-HS1 -: Heat spreader for LEC-AL-E3930/E3940/E3950
  • LEC-AL-HS2 -: Heat spreader for LEC-AL-N3350/N4200
  • LEC-AL-HS3 -: Active heatsink for LEC-AL
  • LEC-AL-HS4 -: Integral passive heatsink for LEC-AL-E3930/E3940/E3950
  • LEC-AL-HS5 -: Integral passive heatsink for LEC-AL-N3350/N4200
    Starter Kit –
  • LEC-Starterkit 2.0 -: LEC-Starterkit with LEC-BASE 2.0 carrier, LVDS display, SD card, and ATX power supply (without LEC module and cooling solution)
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